AMD Confirms Soldered IHS for 2nd Generation Ryzen CPUs

Overclockers Rejoice! Soldered IHS on 2nd Gen Ryzen

Overclockers have been disillusioned by thermal limitations via non-soldered integrated heatspreaders (IHS). This is because Intel has been using thermal interface material in between their CPU die contact surface and IHS for several generations now. This results in sub-par overclockability unless the user delids the processor. This of course, voids the warranty or worse, damages it permanently if not done properly. Of course, Intel doesn’t mind since it means more profit for them. Plus, it is swaths of enthusiasts voiding their warranties voluntarily.

In his latest video, overclocker Der8auer has delidded AMD’s latest Raven Ridge APU showing that AMD is using TIM instead of soldered IHS as well. This of course worried some AMD fans that they might be going the Intel route for the next Ryzen release. However, Robert Hallock from AMD chimed in on Reddit and confirmed that the next-generation Ryzen CPUs will in fact feature soldered TIMs.

When Are These AMD CPUs Coming Out?

These upcoming Ryzens are 12nm CPUs in comparison to 14nm with the 1st gen Ryzen. The expected release is sometime in Q1 2018, while using the same AM4 platform. This lets users who have a 1st gen Ryzen to upgrade with just a BIOS update before hand. Unlike Intel who required a motherboard change between 7th and 8th generation releases, AMD promises that AM4 is sticking around for a while.

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