AMD is working on significant improvements for its upcoming Ryzen 9000X3D series. During Computex 2024, AMD’s senior technical marketing manager, Donny Woligroski, shared insights into the new 3D V-Cache technology. He emphasized that AMD is not just maintaining its current standards but is actively improving its offerings.
Woligroski hinted at several exciting developments, though he did not provide specific details. One possible enhancement is the implementation of different sizes of 3D V-Cache to offer more variety across different models. Currently, the 3D V-Cache slice size is 64MB, regardless of the model. Adjusting this could provide greater differentiation and performance improvements.
Integrating 3D V-Cache into AMD’s APUs, such as the Ryzen 8040U and Ryzen AI 300 series, could also enhance performance. These processors already have a decent integrated GPU but lack sufficient memory bandwidth. Adding 3D V-Cache could significantly improve their efficiency and gaming capabilities.
The first generation of 3D V-Cache was introduced with Zen 3 processors, with AMD managing to shrink the size slightly for Zen 4. For the next generation, AMD might use a smaller process node, potentially increasing the cache size without increasing the die size. This could result in higher boost clocks and better overall performance.
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