ASUS Updates X299 ROG Rampage VI Apex VRM Heatsink After Der8auer’s Criticism
Following the statements made by Der8auer several weeks ago, ASUS is updating the design to their X299 ROG Rampage VI Apex motherboard in response. The original video by Der8auer calls Intel’s X299 platform “problematic for overclocking” considering its high power draw and high temperatures, coupled with inadequate VRM cooling.
Old vs New ROG Rampage VI Apex VRM Heatsink Design
The most noticeable change from the original design vs the new updated version are the presence of airflow fins. The original design basically is a solid aluminum block. This was connected to a heatpipe that also distributes heat to the rear IO assembly. The addition of airflow fins allows any airflow or active cooling source to disperse heat absorbed by the heatsink from the MOSFETs.
It appears that ASUS contacted Der8auer directly and gave him the exclusive on the pre-launch version. This allowed the overclocker to test out the heatsink and give his feedback to ASUS before it hits the market. Unlike the original design from Computex, the new heatsink design also has mounting points for a fan. The back of the motherboard also has a backplate to absorb some of the heat. This heat is from the MOSFETs on the other side, helping cool further.
Der8auer’s ASUS Rampage VI Apex VRM Check Video
Check out the full video below to see more details about this new re-design.
It’s still garbage compared with what should be…WHY make thins SO THICK and at a angle,etc. ?
Amen. I’d love having those high, soldered old aluminum heatsinks like they used on the DFI Lanparty 939 boards!
Respect for Roman, he talks Asus listens.
ASUS should probably take a note from their X99 WS series of motherboards which had actual, proper heatsinks for the VRMs