With Gamescom Right around the corner, everyone is gearing up to see many new games, previews and gameplay and all sorts of other exciting gaming news. But before Gamescom was underway, Asus held an event to showcase some new products and give us an insight into the upcoming X670 platform from AMD.
We were brought over to have a look at the newest range of motherboards from ASUS for the upcoming X670 platform that will come with the launch of the Ryzen 7000 series of CPUs. This launch is going to bring a whole load of new technology and many changes to the Ryzen platform. The first thing that we really wanted to look at was the new LGA socket, which is a first for the Ryzen CPUs.
What we managed to see doesn’t really tell us much about the CPUs but it’s always interesting to take a look at and see it for ourselves. Unlike Intels sockets which have a gap in the middle of the pins to make enough clearance for the parts of the CPU that aren’t under the IHS, the AM5 socket is nothing but pins, presumably because the design of the 7000 series of CPUs has a unique design that has components of the CPU exposed in little cut outs in the IHS.
You can also see our video on this event below.
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