Intel “Broadwell-DE” 14nm Low Power CPUs and SoCs To Arrive This Year

Intel will apparently broaden its low power CPU offerings later this year with the arrival of Broadwell. The current line-up consists of the socketed Xeon E3 Haswell CPUs and the Atom C2000 SoCs – both based on 22nm technology. From later on this year Intel will apparently bring Broadwell technology into the line-up in the form of both traditional socketed CPUs that will replace the current Xeon E3 line but also new BGA package SoCs that will sit alongside those traditional socketed CPUs. These new BGA SoCs are the “Broadwell-DE” family and form the “Grangeville” platform. The current Atom line-up will be replaced by the newer Denverton 14nm based Atom processors.

Broadwell-DE will be manufactured in a BGA package and early details suggest up to 8 cores will be available all using 14nm Broadwell technology. The BGA CPUs will also integrate a memory controller, I/O block and PCH logic. There is 1.5MB of L3 cache per core so 12MB of L3 cache on a fully fledged 8 core part. The Broadwell-DE platform features Hyper-Threading, Turbo Boost, VT-x and VT-d virtualization, Trusted Execution, AES and AVX2 extensions, QuickData technology 3.3, Processor Trace (can capture details of code execution), supervisor mode access prevention, and extensions to ADC instruction. The memory controller is dual channel supporting DD3L memory up to 1600MHz and DDR4 memory up to 2400MHz depending on the SKU. Each memory channel supports up to 2 DIMMS meaning 4 DIMMs max in total at a maximum capacity of 32GB per module for 128GB in total. The I/O block on the Broadwell-DE package supports a 10Gbe ethernet controller, 24 PCIe 3.0 lanes, 8 PCIe 2.0 lanes, 1Gb ethernet controller, 6 SATA III ports, 4 USB 3.0 ports and 4 USB 2.0 ports. The power consumption details and pricing are yet to be specified.

Source: CPU World

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