Intel Quietly Adds the B365 Chipset to their 300-Series Lineup

Budget 22nm Chipset from Intel

Rumours of an upcoming Intel B365 chipset arriving at Computex 2019 surfaced last week. However, it appears that it is actually launching much earlier than expected. In fact, Intel has already quietly announced its presence and put a web page up for the new chipset.

Other than the actual launch date, it appears that some aspects of the B365 is also different from what was expected. While the chipset is indeed made using 22nm process, it resembles Kaby Lake’s H270 chipset closely than the B360 in terms of features.

How Does the B365 Chipset Compare to the B360 and H270?

First it has more PCIe 3.0 lanes than the B360, up to 20 from 12. It also increases the total number of USB ports from 12 to 14. Also, another big advantage with the B365 is the inclusion of hardware RAID for PCIe and SATA storage support.

One thing the B360 gets to keep that the B365 does not have however, is USB 3.1 Gen 2. Moreover, it does not get the integrated Wireless-AC MAC either. Motherboard makers would have to use 3rd party chips to make use of these if they wish to do so.

So this is basically just an H270 chipset for Coffee Lake CPUs. It even has the older Management Engine Firmware version 11 instead of 12.

Now that it is official, we can most likely see B365 motherboards within the next few weeks.