Intel is stepping up as a foundry partner for NVIDIA, aiming to produce (thanks Wccftech) 5000 H100 wafers per month starting soon. This collaboration highlights NVIDIA’s struggle to meet the surging demand for AI GPUs, which current suppliers, like TSMC, are unable to fully satisfy.
NVIDIA’s decision to work with Intel Foundry Services (IFS) marks a significant shift. Intel’s IDM 2.0 strategy, focusing on expanding its foundry services, has positioned it as a key player in AI chip manufacturing. Intel’s Foveros 3D packaging technology will be pivotal in meeting NVIDIA’s needs. This technology is comparable to TSMC’s CoWoS-S packaging, which is currently in short supply.
Intel plans to supply 5000 packaging wafers monthly, significantly boosting NVIDIA’s production capacity. These wafers are likely for the H100 GPU, a crucial component in AI advancements. NVIDIA’s existing reliance on TSMC for its high-demand products like the H100, A100, and others, has faced bottlenecks due to limited supply.
This partnership is a win for both companies. For NVIDIA, it means a more robust supply chain for its AI chips. For Intel, it’s a step towards establishing itself as a leader in the AI chip manufacturing space.
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