Lian Li will be present at CeBIT 2012

The world leading high-end PC case maker Lian Li has confirmed its presence at CeBIT 2012 next month. On display at their booth you’ll be able to get a hands-on preview of the products that have yet to be released on the market.

Lian Li invites and welcomes all distributors, system integrators, media, and technology enthusiasts to visit their booth to discover the new products including everything from mini, mid and to full tower chassis equipped with improved, easy-to-remove snap-in panels for simple installations.

The manufacturer has recognized the fact that everyone is looking for more space saving yet easily accessible servers and has in fact been dedicated to optimize such features without losing the efficiency, style and power from the smallest of the chassis to the largest.

In presentation will see some new and more compact designs of a variety of small enclosures to care for the various requirements of each user. Staying true to their philosophy, the more compact chassis will still come equipped with features more commonly found on full tower chassis which are also going to be presented with new features maximizing noise reduction, cable management, thermal solutions and tool-less designs.

In addition the constructor will also present some of Lancool’s newest chassis, made of steel instead of aluminium, visitors will be able to see for themselves what they’re all about.

Furthermore, Lian Li puts its years of experience in aluminium workmanship and collaboration with various teams and companies to welcome any custom OEM manufacturing requests.

Lian Li will present all of this at hall 17, booth no J18 from March 6 to March 18 at CeBIT 2012 (at the Deutsche Messe in Hannover, Germany).

Source: Press Release