Unique design is the most apparent factor of Prolimatech’s Genesis. The top-down style fin array creates extra surface area to dissipate heat transferred from the CPU. It also acts as a fan mount ideally positioned for effective VRM, RAM and MOSFET cooling.
Both identically designed fin arrays feature specific performance-enhancing grooves and channels. All 6 of the 6mm heatpipes protrude from the summit of each tower by a few millimetres extending the Gensis’ height to 160mm and width to a huge 216.5mm.
The rear-facing curves of each of the 6 heatpipes entering the top-down tower keep clearance around the CPU socket area to a maximum. When entering the upright tower, the slightly smaller gradient at which each heatpipe is angled could possibly cause some clearance issues with tall VRM heatsinks. A decent sized gap in the centre of the heatsink allows clearance for the more daring enthusiasts to mount 38mm wide fans.
50% of the total number of heatpipes enter either side of the fin array leaving a wide gap in the central position between them. Heat is transferred to the sides of the array where it can receive the maximum amount of airflow from a 120/140mm fan. If the heat isn’t dissipated quickly around the outside of the array, it can conduct towards the centre where it will receive less airflow due to the fan’s ‘dead spot’. Prolimatech’s engineering intelligence is proved with this design as it reduces the chance of heat build up in a location where cool air can’t reach the aluminium fins directly.
A non-mirrored, nickel-plated copper base will conduct thermal energy away from the CPU allowing it to be transferred to the cooling stacks via the 6mm heatpipes. Almost instantly after exiting the base, each heatpipe is directed towards its intended location which results in a minimal amount of transfer time between the base and heat fins.
We will be using a pair of 140mm Prolimatech Blue Vortex 14 fans with our sample of the Genesis. Operational speed of 1000 RPM and stated airflow of 87 CFM should allow these fans to show the heatsink’s cooling potential for low-noise but high-performance orientated consumers.
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