Samsung has revealed its foundry’s roadmap for the next few years, which includes the development of a low-cost 14nm FinFET process (14LPC), with hopes that it can pass on those savings to its customers, and a new 10nm process (10LPP) that increases performance by up to 10% over its previous 10LPE process.
Samsung foundry’s process technology roadmap for the coming years includes:
“There are always concerns about trading off cost versus performance,” Kelvin Low, Samsung’s Senior Director of Foundry Marketing, told EE Times. “LPC has the same PDK of [14nm] LPP. The number of steps has been reduced […]That allows us to achieve a lower cost point on manufacturing and we decide to share that with our customers.”
“We think 10nm will be a much longer node than other foundries are claiming it will be. We think 7nm has to be defined and optimized to be cost effective to the masses, not just the high margin products,” he added. “EUV is an important enabler for a 7m cost affordable node.”
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