Samsung Electronics is increasing production of its 8GB High Bandwidth Memory-2 (HBM2) DRAM. The move, the company says, is to meet the ever-growing demand for HBM2. In particular, AI, HPC, advanced graphics, network systems, and enterprise servers increasingly rely on the emergent technology. On a consumer level, though, HBM2 is helping to power the next generation of PC graphics cards.
HBM2 – which, as the name suggests, is second-generation High Bandwidth Memory – is the new replacement for DDR and GDDR DRAM. The original HBM merely served as a trial run for the HBM2 standard. While HBM2 will have wide support, Intel hopes its Micron 3D XPoint Optane technology will be a suitable rival. HBM2 is set to be a major component in AMD’s Vega graphics cards. SK Hynix is already preparing to deliver HBM2 memory before the end of 2017.
Jaesoo Han, Executive Vice President of Memory Sales & Marketing team at Samsung Electronics, said:
“By increasing production of the industry’s only 8GB HBM2 solution now available, we are aiming to ensure that global IT system manufacturers have sufficient supply for timely development of new and upgraded systems. We will continue to deliver more advanced HBM2 line-ups, while closely cooperating with our global IT customers.”
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