Samsung Set to Unveil 3D Chip Packaging for HBM4 by 2025

Samsung plans to introduce its innovative SAINT 3D packaging services by 2025. This move aims to prepare for the next generation of high bandwidth memory, HBM4, expected to debut by 2026.

SAINT 3D Packaging Technology

Samsung’s SAINT (Samsung Advanced Interconnect Technology) will revolutionize chip packaging. Unlike the previous 2.5D method, this new technology focuses on vertical stacking of chiplets. This approach reduces the distance between chiplets, leading to faster data transfer and improved efficiency. The vertical stacking method also minimizes the carbon footprint, making it more environmentally friendly.

HBM4

Samsung’s new packaging services are geared towards the upcoming HBM4 memory standard. This high bandwidth memory will significantly enhance performance in AI, data centers, and graphics. Samsung showcased this technology at the Samsung Foundry Forum 2024 in San Jose, California, highlighting its potential to boost next-gen AI hardware from NVIDIA and AMD.

The introduction of SAINT 3D packaging marks a significant step for Samsung in the semiconductor industry. By 2027, Samsung plans to launch an all-in-one heterogeneous integration technology, aiming to unify AI packaging methods. This positions Samsung as a key player in the evolving landscape of chip technology, competing with giants like TSMC, Intel, and AMD.

Samsung’s innovative approach ensures it remains at the forefront of technological advancements, promising faster, more efficient, and eco-friendly solutions for future computing needs.