Samsung working on 30nm-class 32GB Green DDR3 for servers

Samsung has today announced that it is developing 32GB DDR3 RDIMMs that use 3D TSV package technology…..or in other words 32 gigabyte double data rate-3 registered dual Inline memory modules that use three dimensional through silicon via package technology, still following?

According to Samsung, the 30nm class technology would allow for greener memory solutions and still deliver performance superior to that of the 40nm based memory modules. Samsung already has a step forward for engineering samples have already been released for evaluation.

“These 32GB RDIMMs fully support the high-density and high-performance requirements of next-generation high-capacity servers,” said Wanhoon Hong, executive vice president, memory sales & marketing, Device Solutions, Samsung Electronics. “We will keep providing memory solutions with higher performance and density, while enhancing shared value in the design of ever-greener server systems,” he added.

As for performance, these module would be capable of transmit speed of up to 1,333 MB/s which would mean a 70% increase of the preceding modules with speeds of 800 MB/s.

Thanks to the TSV technology, these 30nm-class memory module only consume 4.5 watts per hour, making them the lowest consumption among the actual server memory modules.

The TSV technology enables a multi-stacked chip to function at levels comparable to a single silicon chip by shortening signal lines significantly, therefore lowering power consumption and achieving higher density and operational speed.

Samsung has been working along with CPU and controller designers and some current server system customers so that a quicker transition to the newest technology could be facilitated.

For more information, please go to Samsung Green DDR3.

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