Sapphire Radeon RX 7900 XT Nitro+ Vapor-X 20GB GDDR6 PCI-Express Graphics Card

James Cusworth / 6 months ago

At the core of the NITRO+ Graphics Cards series are the technologies of the SAPPHIRE PANTHEON Suite ofpermanent features. SAPPHIRE PANTHEON guarantees supreme cooling technology and other distinctfeatures exclusive to NITRO+ graphics cards. Each NITRO+ iconic feature stands as strong and permanent asthe pillars of the PANTHEON. Every NITRO+ Graphics Card guarantees the presence of the stable, reliableand innovative SAPPHIRE PANTHEON suite of features.
On NITRO+ AMD Radeon™ RX 7900 XTX Vapor-X, 90 Ampere Mosfets for GPU with 12 phases is engineeredonto the board. This digital power design provides a total of 1080 Ampere currents to the GPU, offering28% more power delivery for the GPU in comparison to the standard AMD Radeon™ RX 7900 XTX design, topush maximum overclocking potential.
The NITRO+ AMD Radeon™ RX 7900 Series Vapor-X Graphics Cards are constructed with a Die CastedAluminum-Magnesium Alloy Frame that strengthens the structural stiffness of the shroud and ensuresdurability whilst enveloping the sides of the PCB. Located on top of the frame is the Frontplate Heatsinkwhich overlays the entire PCB to cool the VRM components as a dedicated VRM cooling module to createoptimal heat dissipation for peak airflow and cooling performance.
The NITRO+ AMD Radeon™ RX 7900 Series Vapor-X Graphics Cards are equipped with the latest AngularVelocity Fan Blade Design to allow for greater airflow while simultaneously enabling quiet and cooloperation. This design generates up to 44% more downward air pressure and up to 19% more airflowcompared to previous generation fan blades. The renowned and robust Tri-X Cooling Technology works in tandem with the Wave Fin Design to diminish friction and airflow which reduces noise, and the V Shape Fin Design for GPU Cooling to quicken and centralize airflow around the GPU to dissipate heat efficiently.
The GPU is mounted onto the High TG Copper PCB. Constructed of 14 layers of high-density 2oz Copper PCBwith a high TG [Glass Transition] temperature value PCB to match the power requirements of the GPU andmemory and guarantee mechanical stability of the PCB during operation. The board design uses premiumand efficient compact Ultra High Performance Conductive Polymer Aluminum Capacitors which fullyenables the 20-phase power design of the PCB.