SK Hynix has claimed to be the first company to mass-produce 321-layer NAND memory chips. Called “4D NAND,” these chips were introduced during the summer of 2023, but it was not until now that the company began mass-producing these memory chips, thus becoming the first company to achieve this density.
Each of these 4D NAND chips from SK Hynix has a capacity of 1 Tb, which will allow the creation of devices with greater storage capacities in a smaller space. In terms of performance, the company promises a 12% improvement in data transfer speed and a 13% improvement in read speed compared to the previous generation of 4D NAND memory.
These chips will be used in all kinds of products, but SK Hynix points out that they are especially designed for AI systems that require high-performance data access with lower power consumption.
As for the competition, Samsung is already working on chips with 400 layers, although they have not yet started production. Looking even further ahead, Kioxia has plans for its 3D NAND memory chips to reach 1,000 layers, but this will not be until 2027.
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