TeamGroup Z540 M.2 PCIe SSD & DARK AirFlow I SSD Cooler Review

When it comes to extreme storage, there’s actually quite a few great options on the market right now. PCIe Gen5 drives rarely disappoint when it comes to read and write speeds, albeit they do cost a fair bit more money than the older Gen4 drives. They also tend to run quite a lot hotter than the old drives, with their extreme speeds often generating over 100c temperatures with extended usage. To get the best out of these drives, keeping them cool is key, which is why today we’ve got one of the fastest TeamGroup SSDs, but also one of their innovative new T-FORCE DARK AirFlow I SSD Coolers. Together, they should deliver some pretty amazing performance!

What TeamGroup Had to Say

“T-FORCE Z540 M.2 PCIe 5.0 SSD adopts the latest PCIe Gen5x4 interface and supports the latest NVMe 2.0 protocol. It offers astonishing continuous read/write speeds of 12,400 and 11,800 MB/s, enabling users to unleash impeccable speed in launching games and enjoy carefree gaming experiences. The T-FORCE DARK AirFlow I SSD Cooler adopts double copper heat pipe, multilayered aluminum alloy heat dissipation fins, intelligent PWM fan with high wind pressure, and double-layered graphene heat dissipation structure to offer a stable and exceptional heat dissipation solution. It is the perfect premium M.2 2280 active heat cooler.”

Z540 M.2 PCIe SSD Features

• Astonishing new-generation impeccable speed to unleash gaming performance
• The miraculous force of graphene 
• The best heat dissipation solution
• Intelligent thermal conditioning
• Concrete actions to safeguard Earth 
• Patented S.M.A.R.T. monitoring master
• Quality service for user assurance  
• Patented graphene heatsink
  US invention patent (certificate no. : US11051392B2)
  Taiwan invention patent (certificate no. : I703921)
  China utility patent (certificate no. : CN 211019739 U)
• S.M.A.R.T. patented software
  Taiwan invention patent : I751753

T-FORCE DARK AirFlow I SSD Cooler

• Premium M.2 2280 active heat cooler
• Double copper heat pipe for faster heat transfer
• Multilayered aluminum alloy heat dissipation fins for doubled heat dissipation area
• Intelligent PWM fan with high wind pressure for faster cooling and heat dissipation
• Patented double-layered graphene heat dissipation structure
  Taiwan Utility Patent (number: M644665)

Specifications