While TSMC is following an aggressive roadmap for 7nm in 2017, the world’s largest contract chipmaker will also soon begin to make cutting edge 5-nanometre chips in small quantities by the first half of 2019, according to Co-Chief Executive Mark Liu. Speaking to attendants at a recent TSMC supplier meeting, Liu claims that the company is progressing well on advanced technologies and has even disclosed details for 3-nanometre chip technology development. TSMC will be the first chipmaker to possess 5-nanometre chip technology if the roadmap goes according to plan, ahead of both Intel and Samsung in the global contract chipmaking market.
In the 7-nanometre process, TSMC is entering risk producting in the end of the first quarter of 2017, with expected mass production entry in 2018. Enhanced versions of the 7-nanometre technology with importing EUV equipment will also be launched. The 5-nanometre technology on the other hand is officially entering development stage and scheduled to enter risk production in 1H 2019 which is six months ahead of their original schedule. TSMC’s 3-nanometre technology is currently in the roadmapping stage and has tasked several hundred R&D personnel to see its development.
TSMC this year plans to increase Research and Development spending by 15 percent from 2016 (from $2.1 billion USD), alongside a capital expenditure of US$10 billion in order to maintain their lead. The chipmaker has 55% of the market share, dominating with its 16nm chip orders for the iPhone 7 range. TSMC’s 10nm technology is expected to be adopted by Apple as well for their upcoming range.
