VIA Technologies today announced the latest VIA COMe-8X90 module, featuring a 1.2 GHz VIA Nano X2 E-Series dual core processor and the VIA VX900H media system processor (MSP). The ruggedized VIA COMe-8X90 module targets industrial PC and large OEM customers focused on application segments, including medical, advanced gaming, industrial automation and digital signage.
Measuring 95 mm x 125 mm, COM Express is an industry standard embedded form factor developed and maintained by the PCI Industrial Computer Manufacturers Group. COM Express modules integrate core CPU, chipset and memory on the module, providing support for extensive connectivity options, including USB, audio, video, and Ethernet, through board-to-board connectors to an I/O carrier board.
Along with the VIA COMe-8X90 module, VIA offers a comprehensive starter kit, including a multi-I/O carrier board reference design, board support packages (BSPs), display, system monitoring tools/SDKs, and design guide, enabling industrial PC and OEM customers to customize their solutions.
“Embedded modules are ideal for creating highly tailored solutions with a short time to market approach,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “The VIA COMe-8X90 module provides customers with an easily customizable platform with power efficient processing and rich I/O options, allowing them to quickly create optimized products for their target markets.”
Source: PR
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