Samsung announced that they started the mass production of their ePoP (embedded package on package) memory – a single memory package consisting of 3GB LPDDR3 DRAM, 32GB eMMC Flash and a controller.
The tiny package is only 15 x 15mm which allows it to be stacked right on top of the processor, returning space for other components in the ever slimming mobile devices. The mobile DRAM inside the ePoP operates at a data transfer rate of 1,866Mb/s and sports a 64-bit I/O bandwidth.
“By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features,” Jeeho Baek, Senior Vice President of Memory Marketing at Samsung Electronics. “We plan to expand our line-up of ePoP memory with packages involving enhancements in performance and density over the next few years, to further add to the growth of premium mobile market.”
In comparison, a dual chip solution would take up 374.5 square millimeters versus the ePoP’s 225, approximately a 40% reduction. The single-package configuration also meets the semiconductor package height ceiling of 1.4 millimeters (mm).
Thanks to Samsung for providing us with this information
