Qualcomm has officially unveiled its new Snapdragon 820 Processor at an event in New York City. A number of leaks have already revealed the Snapdragon 820’s benchmark, as well as rumours that the chip is prone to overheating.
“As one of the most cutting-edge mobile processors ever created,” Qualcomm’s site reads, “the Qualcomm® Snapdragon™ 820 processor with X12 LTE supports the ultimate in connectivity, graphics, photography, power and battery efficiency.”
The Snapdragon 820 is X12 LTE-enabled through its new set of modems, capable of achieving Cat 12 downlink speeds of up to 600Mbps vai 3x20MHz Carrier Aggregation support, 33% faster than the X10 LTE equivalent, plus Cat 13 uplink speeds of up to 150Mbps though 64-QAM (Quadrature Amplitude Modulation) support.
Qualcomm’s chip features a Quad-core, custom 64-bit Kyro CPU (of up to 2.2GHz) and a Hexagon 680 DPS, bringing with them improvements to performance (double the previous iteration) and battery life, plus an Adreno 530 GPU, increasing graphics performance by 40% while drawing less power than the Adreno 430. The chip supports camera sensors of up to 28-megapixels, 4K video capture, playback, and display output, and LPDDR4 1866MHz dual-channel RAM. It also supports Quick Charge 3.0, USB 3.0, and Bluetooth 3.0.
Full specifications for the Qualcomm Snapdragon 820:
CPU
Up to 2.2 GHz quad-core (Quad-core custom 64-bit Qualcomm® Kryo™)
GPU
Qualcomm® Adreno™ 530 GPU
Up to OpenGL ES 3.1+
DSP
Qualcomm® Hexagon™ 680 DSP
Camera
Up to 28 MP
Qualcomm® Spectra™ Image Sensor Processor (14-bit dual-ISP)
Video
Up to 4K Ultra HD capture and playback
H.264 (AVC)
H.265 (HEVC)
Display
4K Ultra HD on-device
4K Ultra HD output
1080p and 4K external display support
Charging
Qualcomm® Quick Charge™ 3.0 LTE Connectivity
LTE Connectivity
Snapdragon X12 LTE with Global Mode
LTE Cat 12/13 (up to 600 Mbps DL 150 Mbps UL)
Up to 600 Mbps, 256-QAM DL
Up to 150 Mbps UL, 64-QAM UL
Carrier Aggregation
3x20MHz DL, 2X20MHz UL
Global Mode
- LTE FDD and TDD
- WCDMA (DB-DC-HSDPA, DC-HSUPA)
- TD-SCDMA
- EV-DO and CDMA 1x
- GSM/EDGE
Additional features include:
- LTE/Wi-FI link aggregation
- LTE-U
- LTE Broadcast
- LTE Dual SIM, Dual Active (DSDA)
- HD Voice over 3G and VoLTE
- Wi-Fi calling with LTE call continuity
Wi-Fi
Qualcomm® VIVE™ 802.11ac
2×2 MU-MIMO
Tri-band Wi-Fi
RF
Qualcomm® RF360™ front end solution
Location
Qualcomm® IZat™ Gen8C Security
Security
Qualcomm® Haven™ Security Suite:
- Qualcomm® SecureMSM™ hardware and software
- Snapdragon StudioAccess™ Content Protection
- Qualcomm® SafeSwitch™ theft prevention solution
- Qualcomm® Snapdragon Sense™ ID 3D fingerprint technology
- Qualcomm® Snapdragon™ Smart Protect
Storage
UFS 2.0
eMMC 5.1
SD 3.0 (UHS-I)
Memory
LPDDR4 1866MHz dual-channel
Process Technology
14 nm
USB
USB 3.0/2.0
Bluetooth
Bluetooth 4.1
NFC
Supported
Part Number
8996
